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HS Code 59119091 - semiconductor wafer polishing pads
Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers
Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)
Examples (No official information or warranty)
- Polishing pads for silicon wafer planarization
- CMP pads for semiconductor fabrication
- Wafer polishing discs (adhesive-backed)
- IC manufacturing polishing pads
- Semiconductor wafer lapping pads
- Microelectronic substrate polishing pads
- CMP pads for semiconductor fabrication
- Wafer polishing discs (adhesive-backed)
- IC manufacturing polishing pads
- Semiconductor wafer lapping pads
- Microelectronic substrate polishing pads
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SLTrade restrictions and policies
Chapter 59
58 Trade restrictions and policies
Position 5911
2 Trade restrictions and policies
Subheading 591190
1 Trade restrictions and policies
Customs Tariff Number 59119091
Changes to this tariff number
Changes in favor of 59119091
2016:
59119090
➜
2017:
59119091