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HS Code 85480020 - memory modules dram
Memories in multicombinational forms such as stack D-RAMs and modules
Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)
Examples (No official information or warranty)
- Stacked DRAM modules (e.g., HBM - High Bandwidth Memory)
- Memory modules with integrated heat spreaders (e.g., DIMMs)
- Multi-chip package memory (e.g., MCP)
- Memory stacks using through-silicon vias (TSV)
- Hybrid Memory Cube (HMC) modules
- 3D stacked memory assemblies
- Wide I/O memory stacks
- Memory modules with integrated heat spreaders (e.g., DIMMs)
- Multi-chip package memory (e.g., MCP)
- Memory stacks using through-silicon vias (TSV)
- Hybrid Memory Cube (HMC) modules
- 3D stacked memory assemblies
- Wide I/O memory stacks
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SLTrade restrictions and policies
Chapter 85
45 Trade restrictions and policies
Position 8548
13 Trade restrictions and policies
Subheading 854800
13 Trade restrictions and policies
Customs Tariff Number 85480020
1900-01-01
ERGA OMNES (1011)
Third country duty
Regulation 1832/21
1900-01-15
All third countries (1008)
Export authorization (Dual use)
Regulation 2003/25
Changes to this tariff number
Changes in favor of 85480020
2021:
85489020
➜
2022:
85480020