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HS Code 59119091 - polishing pads semiconductor wafers
Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers
Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)
Examples (No official information or warranty)
- IC1000 polishing pads (chemical mechanical planarization)
- Politex felt polishing pads (finishing stage)
- Suba IV conditioning pads (wafer surface preparation)
- Durafoam fixed abrasive pads (polishing)
- Epic D100 pads (semiconductor-grade)
- Perforated polishing pads for CMP
- Politex felt polishing pads (finishing stage)
- Suba IV conditioning pads (wafer surface preparation)
- Durafoam fixed abrasive pads (polishing)
- Epic D100 pads (semiconductor-grade)
- Perforated polishing pads for CMP
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SLTrade restrictions and policies
Chapter 59
58 Trade restrictions and policies
Position 5911
2 Trade restrictions and policies
Subheading 591190
1 Trade restrictions and policies
Customs Tariff Number 59119091
Changes to this tariff number
Changes in favor of 59119091
2016:
59119090
➜
2017:
59119091