HS Code 39199020 - self-adhesive polishing pads semiconductor wafers plastics

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics

Examples (No official information or warranty)

- CMP polishing pads (polyurethane)
- Wafer planarization pads (IC fabrication)
- Silicon wafer polishing discs
- Semiconductor lapping pads (adhesive-backed)
- Chemical mechanical planarization pads
- Microelectronic polishing pads (circular)
- Nanofabrication polishing pads (plastic film)

Code Tree Structure / Hierarchy

    3919 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls 391990 Other 39199020 Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers 39199080 Other

Trade restrictions and policies

Chapter 39
44 Trade restrictions and policies
Position 3919
16 Trade restrictions and policies
Subheading 391990
0 Trade restrictions and policies
Customs Tariff Number 39199020
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Changes to this tariff number

Changes in favor of 39199020
2016: 39199000
2017: 39199020