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HS Code 39199020 - self-adhesive polishing pads semiconductor wafers plastics
Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics
Examples (No official information or warranty)
- CMP polishing pads (polyurethane)
- Wafer planarization pads (IC fabrication)
- Silicon wafer polishing discs
- Semiconductor lapping pads (adhesive-backed)
- Chemical mechanical planarization pads
- Microelectronic polishing pads (circular)
- Nanofabrication polishing pads (plastic film)
- Wafer planarization pads (IC fabrication)
- Silicon wafer polishing discs
- Semiconductor lapping pads (adhesive-backed)
- Chemical mechanical planarization pads
- Microelectronic polishing pads (circular)
- Nanofabrication polishing pads (plastic film)
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Trade restrictions and policies
Chapter 39
44 Trade restrictions and policies
Position 3919
16 Trade restrictions and policies
Subheading 391990
0 Trade restrictions and policies
Customs Tariff Number 39199020
Changes to this tariff number
Changes in favor of 39199020
2016:
39199000
➜
2017:
39199020