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HS Code 39199020 - self-adhesive polishing pads semiconductor wafers plastics

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics

Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- CMP polishing pads (polyurethane)
- Diamond suspension polishing pads
- PSA-backed lapping pads (PVA foam)
- Fixed abrasive pads for wafer planarization
- Polyester film carrier pads
- Slurry dispensing pads (adhesive-backed)
- Polyurethane foam pads (pressure-sensitive adhesive)