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HS Code 39199020 - self-adhesive polishing pads semiconductor wafers plastics

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics

Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- CMP polishing pads (8-inch diameter)
- Chemical mechanical planarization pads (12-inch)
- Wafer polishing discs (adhesive-backed)
- Semiconductor lapping pads (multi-layer)
- IC manufacturing polishing pads (pressure-sensitive adhesive)
- Silicon wafer polishing pads (polyurethane)
- Planarization pads for semiconductors (PVA foam)