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HS Code 39199020 - self-adhesive polishing pads semiconductor wafers plastics

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics

Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- Polishing pads for silicon wafer finishing
- CMP pads for semiconductor planarization
- PSA-backed lapping discs for wafers
- Circular adhesive pads for wafer polishing (diameter 20 inches)
- Non-woven abrasive pads for wafer manufacturing
- Polyurethane polishing pads with adhesive layer
- Conditioning pads for CMP processes