HS Code "wafer" Search results (48)

wood particle boards
4410
Position
Particle board, oriented strand board "OSB" and similar board "e.g. waferboard" of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances (excl. fibreboard, veneered particle board, cellular wood panels and board of ligneous materials agglomerated with cement, plaster or other mineral bonding agents)
441011
Subheading
Particle board of wood, whether or not agglomerated with resins or other organic binding substances (excl. oriented strand board and waferboard, fibreboard and cellular wood panels)
Particle board of wood, whether or not agglomerated with resins or other organic binding substances, unworked or not further worked than sanded (excl. oriented strand board and waferboard, fibreboard and cellular wood panels)
Particle board of wood, whether or not agglomerated with resins or other organic binding substances, surface-covered with melamine-impregnated paper (excl. oriented strand board and waferboard, fibreboard and cellular wood panels)
Particle board of wood, whether or not agglomerated with resins or other organic binding substances, surface-covered with decorative laminates of plastics (excl. oriented strand board and waferboard, fibreboard and cellular wood panels)
Particle board of wood, whether or not agglomerated with resins or other organic binding substances (excl. unworked or not further worked than sanded, surface-covered with melamine-impregnated paper or with decorative laminates of plastics, oriented strand board and waferboard, fibreboard and cellular wood panels)
Waferboard and similar board, of wood, whether or not agglomerated with resins or other organic binding substances (excl. particle board, oriented strand board, fibreboard and cellular wood panels)
Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production))
Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics
Boxes, cases, crates and similar articles, of plastic, specially shaped or fitted for the conveyance or packing of semiconductor wafers, masks, or reticles
Boxes, cases, crates and similar articles for the conveyance or packaging of goods, of plastics (excl. special ones for semiconductor wafers, masks or reticles)
doped electronics chemical elements
381800
Subheading
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
Lithium niobate wafer, undoped
bakers wares, wafers, cachets
Extruded or expanded products, savoury or salted (excl. crispbread, rusks, toasted bread, similar toasted products and waffles and wafers)
Fruit tarts, currant bread, panettone, meringues, Christmas stollen, croissants and other bakers' wares containing by weight >=5% of sucrose, invert sugar or isoglucose (excl. crispbread, gingerbread and the like, sweet biscuits, waffles and wafers, and rusks)
Pizzas, quiches and other bakers' wares containing by weight <5% of sucrose, invert sugar or isoglucose (excl. crispbread, gingerbread and the like, sweet biscuits, waffles and wafers, rusks and similar toasted products, bread, communion wafers, empty cachets for pharmaceutical use, sealing wafers, rice paper and similar products)
190590
Subheading
Bread, pastry, cakes, biscuits and other bakers' wares, whether or not containing cocoa; communion wafers, empty cachets of a kind suitable for pharmaceutical use, sealing wafers, rice paper and similar products (excl. crispbread, gingerbread and the like, sweet biscuits, waffles, wafers not mentioned, rusks, toasted bread and similar toasted products)
Communion wafers, empty cachets for pharmaceutical use, sealing wafers, rice paper and similar products
1905
Position
Bread, pastry, cakes, biscuits and other bakers' wares, whether or not containing cocoa; communion wafers, empty cachets of a kind suitable for pharmaceutical use, sealing wafers, rice paper and similar products
190532
Subheading
Waffles and wafers
Waffles and wafers, salted, whether or not filled (excl. of a water content, by weight, of > 10%)
Waffles and wafers, whether or not containing cocoa, whether or not filled (excl. coated or covered with chocolate or cocoa preparations, salted and those with water content of > 10%)
Waffles and wafers of a water content, by weight, of > 10%
Waffles and wafers, whether or not containing cocoa, coated or covered with chocolate or cocoa preparations, in immediate packings of <= 85 g (excl. of a water content, by weight, of > 10%)
Waffles and wafers, whether or not containing cocoa, coated or covered with chocolate or cocoa preparations (excl. in immediate packings of <= 85 g and waffles and wafers of a water content, by weight, of > 10%)
Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers
Parts of machinery, plant and laboratory equipment, whether or not electrically heated, for the treatment of materials by a process involving a change of temperature, and of non-electric instantaneous and storage water heaters, n.e.s. (excl. of medical, surgical or laboratory sterilizers, those for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and of furnaces, ovens and other equipment of heading 8514)
Centrifuges, incl. centrifugal dryers (excl. apparatus for isotope separation, cream separators, clothes-dryers, and centrifuges of a kind used in laboratories and in the manufacture of semiconductor wafers)
Industrial and laboratory furnaces and ovens, resistance heated (excl. hot isostatic presses, bakery and biscuit ovens, and for the manufacture of semiconductor devices on semiconductor wafers)
Furnaces and ovens functioning by dielectric loss (other than for the manufacture of semiconductor devices on semiconductor wafers)
851419
Subheading
Industrial and laboratory furnaces and ovens, resistance heated (excl. hot isostatic presses, and for the manufacture of semiconductor devices on semiconductor wafers)
851490
Subheading
Parts of electric industrial or laboratory furnaces and ovens, incl. of those functioning by induction or dielectric loss, and of industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss, n.e.s. (other than for the manufacture of semiconductor devices on semiconductor wafers)
semiconductor manufacturing machines
8486
Position
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11 C to chapter 84; parts and accessories, n.e.s.
Machines and apparatus for the manufacture of boules or wafers
Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 11 C to chapter 84, n.e.s.
Machine tools for working stones, concrete, asbestos cement or similar mineral substances or for cold-working glass (excl. sawing machines, grinding machines, polishing machines, hand-operated machines and machines for scribing or scoring semiconductor wafers)
Grinding or polishing machines, for working stones, concrete, asbestos cement or similar mineral substances (excl. for cold-working glass, hand-operated machines and machines for working semiconductor wafers)
Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices
Instruments and apparatus for measuring or checking semiconductor wafers or devices, incl. integrated circuits
Instruments and apparatus for measuring or checking electrical quantities, with recording device (excl. appliances specially designed for telecommunications, multimeters, oscilloscopes and oscillographs, and apparatus for measuring or checking semiconductor wafers or devices)
Photomicrographic optical microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles (excl. stereoscopic microscopes)
Optical microscopes for photomicrography, cinephotomicrography or microprojection (excl. fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles, and stereoscopic microscopes)
Electronic assemblies for electrical apparatus for switching or protecting electrical circuits, or for making connections to or in electrical circuits of heading 8535 or 8536 and for control desks, cabinets and similar combinations of apparatus of heading 8537 (excl. for wafer probers of subheading 85369020)
Parts suitable for use solely or principally with the apparatus of heading 8535, 8536 or 8537, n.e.s. (excl. electronic assemblies, and boards, panels, consoles, desks, cabinets and other bases for the goods of heading 8537, not equipped with their apparatus, and for wafer probers of subheading 85369020)
Electronic assemblies for wafer probers of subheading 85369020
Parts for wafer probers of subheading 85369020, n.e.s. (excl. electronic assemblies)