HS Code "semiconductor" Search results (60)

Semiconductor devices, n.e.s.

Parts of diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, light emitting diodes and mounted piezoelectric crystals, n.e.s.

Semiconductor devices "e.g. diodes, transistors, semiconductor-based transducers"; photosensitive semiconductor devices, incl. photovoltaic cells whether or not assembled in modules or made up into panels (excl. photovoltaic generators); light emitting diodes "LED", whether or not assembled with other light-emitting diodes "LED"; mounted piezoelectric crystals; parts thereof

Thyristors, diacs and triacs (excl. photosensitive semiconductor devices)

Photosensitive semiconductor devices (excl. photovoltaic generators and cells)

Semiconductor-based transducers (excl. photosensitive)

Photomicrographic optical microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles (excl. stereoscopic microscopes)

Optical microscopes for photomicrography, cinephotomicrography or microprojection (excl. fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles, and stereoscopic microscopes)

Boxes, cases, crates and similar articles, of plastic, specially shaped or fitted for the conveyance or packing of semiconductor wafers, masks, or reticles

Boxes, cases, crates and similar articles for the conveyance or packaging of goods, of plastics (excl. special ones for semiconductor wafers, masks or reticles)

Non-cellular polyethylene film of a thickness of >= 20 micrometres but <= 40 micrometres, for the production of photoresist film used in the manufacture of semiconductors or printed circuits

Plates, sheets, film, foil and strip, of non-cellular polyethylene, printed, not reinforced, laminated, supported or similarly combined with other materials, unworked or not further worked than surface-worked or only cut to square or rectangular shapes, of a thickness of <= 0,125 mm and of a specific gravity of < 0,94, n.e.s. (excl. not printed stretch film, and polyethylene film of a thickness of >= 20 but <= 40 micrometres for the production of photoresist film used in the manufacture of semiconductors or printed circuits)

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production))

Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11 C to chapter 84; parts and accessories, n.e.s.

Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits

Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 11 C to chapter 84, n.e.s.

Accumulator chargers (excl. polycrystalline semiconductor rectifiers)

Grinding or polishing machines, for working stones, concrete, asbestos cement or similar mineral substances (excl. for cold-working glass, hand-operated machines and machines for working semiconductor wafers)

Machine tools for working stones, concrete, asbestos cement or similar mineral substances or for cold-working glass (excl. sawing machines, grinding machines, polishing machines, hand-operated machines and machines for scribing or scoring semiconductor wafers)

Continuous-action conveyors for goods or materials (excl. specially designed for underground use, continuous-action conveyors with buckets or belts, wheel conveyors and other roller conveyors, pneumatic continuous-action conveyors and automated material handling machines for transport, handling and storage of material for semiconductor devices)

Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor materials

Sound recording or sound reproducing apparatus, using magnetic, optical or semiconductor media (excl. those operated by coins, banknotes, bank cards, tokens or by other means of payment, and turntables)

Sound recording or sound reproducing apparatus (excl. using magnetic, optical or semiconductor media, those operated by coins, banknotes, bank cards, tokens or by other means of payment, and turntables)

Semiconductor media, unrecorded, for the recording of sound or of other phenomena (excl. solid-state non-volatile data storage devices and smart cards)

Semiconductor media, recorded (excl. solid-state non-volatile data storage devices and smart cards)

Media for the recording of sound or of other phenomena, whether or not recorded, incl. matrices and masters for the production of discs (excl. magnetic, optical and semiconductor media, and products of chapter 37)

Media for the recording of sound or of other phenomena, unrecorded, incl. matrices and masters for the production of discs (excl. magnetic, optical and semiconductor media, and products of chapter 37)

Media, recorded, incl. matrices and masters for the production of discs (excl. magnetic, optical and semiconductor media, and products of chapter 37)

Semiconductor media, unrecorded, for the recording of sound or of other phenomena (excl. solid-state non-volatile data storage devices, smart cards and goods of chapter 37)

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers

Printing machinery for use in the production of semiconductors

Printing machinery used for printing by means of plates, cylinders and other printing components of heading 8442 (excl. machinery for printing textile materials, those for use in the production of semiconductors, ink jet printing machines, hectograph or stencil duplicating machines, addressing machines and other office printing machines of heading 8469 to 8472 and offset, flexographic, letterpress and gravure printing machinery)

Parts and accessories of printing machinery for use in the production of semiconductors, n.e.s.

Parts and accessories of printing machinery used for printing by means of plates, cylinders and other printing components of heading 8442, of cast iron or cast steel, n.e.s. (excl. of printing machinery for use in the production of semiconductors)

Parts and accessories of printing machinery used for printing by means of plates, cylinders and other printing components of heading 8442, n.e.s. (excl. of printing machinery for use in the production of semiconductors and of cast iron or cast steel)

Parts of machinery, plant and laboratory equipment, whether or not electrically heated, for the treatment of materials by a process involving a change of temperature, and of non-electric instantaneous and storage water heaters, n.e.s. (excl. of medical, surgical or laboratory sterilizers, those for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and of furnaces, ovens and other equipment of heading 8514)

Electrical particle accelerators for electrons, protons, etc. (excl. ion implanters for doping semiconductor materials)

Centrifuges, incl. centrifugal dryers (excl. apparatus for isotope separation, cream separators, clothes-dryers, and centrifuges of a kind used in laboratories and in the manufacture of semiconductor wafers)

Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices, electronic integrated circuits, printed circuits, and parts of heading 8517 or of computers)

Machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices, electronic integrated circuits, printed circuits, and parts of heading 8517 or of computers)

Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Electrical machines and apparatus for welding thermoplastic materials (excl. wire bonders of a kind used for the manufacture of semiconductor devices)

Parts of machines and apparatus for soldering or welding or for hot spraying of metals, metal carbides or cermets, n.e.s. (excl. wire bonders of a kind used for the manufacture of semiconductor devices)

Parts of electric industrial or laboratory furnaces and ovens, incl. of those functioning by induction or dielectric loss, and of industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss, n.e.s. (other than for the manufacture of semiconductor devices on semiconductor wafers)

Industrial and laboratory furnaces and ovens, resistance heated (excl. hot isostatic presses, and for the manufacture of semiconductor devices on semiconductor wafers)

Industrial and laboratory furnaces and ovens, resistance heated (excl. hot isostatic presses, bakery and biscuit ovens, and for the manufacture of semiconductor devices on semiconductor wafers)

Furnaces and ovens functioning by dielectric loss (other than for the manufacture of semiconductor devices on semiconductor wafers)

Vacuum pumps of a kind used for the manufacture of semiconductors or solely or principally used for the manufacture of flat panel displays

Rotary piston vacuum pumps, sliding vane rotary pumps, molecular drag pumps and Roots pumps (excl. pumps used in semiconductor or flat panel display production)

Diffusion pumps, cryopumps and adsorption pumps (excl. pumps used in semiconductor or flat panel display production)

Vacuum pumps (excl. pumps used in semiconductor or flat panel display production, rotary piston pumps, sliding vane rotary pumps, molecular drag pumps, Roots pumps, diffusion pumps, cryopumps and adsorption pumps)

Instruments and apparatus for measuring or checking electrical quantities, with recording device (excl. appliances specially designed for telecommunications, multimeters, oscilloscopes and oscillographs, and apparatus for measuring or checking semiconductor wafers or devices)

Instruments and apparatus for measuring or checking semiconductor wafers or devices, incl. integrated circuits

Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices

Machinery for moulding or otherwise forming products from rubber or plastics (excl. injection-moulding machines, extruders, blow-moulding machines, vacuum-moulding and other thermoforming machines; machinery for moulding or retreading pneumatic tyres or for moulding or otherwise forming inner tubes; other presses; machines for the manufacture of semiconductor devices or of electronic integrated circuits))

Parts of machinery for working rubber or plastics or for the manufacture of products from these materials of subheading 84771000 to 84778099, n.e.s., of cast iron or cast steel (excl. parts of machines for the manufacture of semiconductor devices or of electronic integrated circuits)

Parts of machinery for working rubber or plastics or for the manufacture of products from these materials of subheading 84771000 to 84778099, n.e.s. (excl. parts of machines for the manufacture of semiconductor devices or of electronic integrated circuits, and of cast iron or cast steel)